MCP47FEB28-E/MQ
vs
MCP47FEB28T-E/MQ
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVQCCN, LCC20,.20SQ,25
|
HVQCCN, LCC20,.20SQ,25
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
6 Weeks
|
6 Weeks
|
Date Of Intro |
2020-06-22
|
2020-06-22
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
Length |
5 mm
|
5 mm
|
Linearity Error-Max (EL) |
0.146484375%
|
0.146484375%
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC20,.20SQ,25
|
LCC20,.20SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1 mm
|
1 mm
|
Settling Time-Nom (tstl) |
7.8 µs
|
7.8 µs
|
Supply Current-Max |
3 mA
|
3 mA
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
|
|
|
Compare MCP47FEB28-E/MQ with alternatives
Compare MCP47FEB28T-E/MQ with alternatives