MCP47FVB18-20E/ST
vs
MCP47FEB18T-E/MQ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP, TSSOP20,.25
|
HVQCCN, LCC20,.20SQ,25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
7 Weeks
|
| Date Of Intro |
2020-06-22
|
2020-06-22
|
| Samacsys Manufacturer |
Microchip
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G20
|
S-PQCC-N20
|
| Length |
6.5 mm
|
5 mm
|
| Linearity Error-Max (EL) |
0.146484375%
|
0.146484375%
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP20,.25
|
LCC20,.20SQ,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Settling Time-Nom (tstl) |
7.8 µs
|
7.8 µs
|
| Supply Current-Max |
3 mA
|
3 mA
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
4.4 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP47FVB18-20E/ST with alternatives
Compare MCP47FEB18T-E/MQ with alternatives