MCP48FEB04T-20E/MQ
vs
MCP48FEB04-E/MQ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
VQFN-20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
5.484 V
|
5.484 V
|
| Analog Output Voltage-Min |
0.01 V
|
0.01 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| Length |
5 mm
|
5 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC20,.20SQ,25
|
LCC20,.20SQ,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Settling Time-Nom (tstl) |
7.8 µs
|
7.8 µs
|
| Supply Current-Max |
3.2 mA
|
2.6 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
6 Weeks
|
| JESD-609 Code |
|
e3
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MCP48FEB04T-20E/MQ with alternatives
Compare MCP48FEB04-E/MQ with alternatives