MF200K04F3-BP
vs
MIMMF200ZB040DK1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSS COMPONENTS
|
Package Description |
R-XUFM-X2
|
MODULE-2
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
ULTRA FAST SOFT RECOVERY
|
ULTRA FAST SOFT RECOVERY
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.35 V
|
1.35 V
|
JESD-30 Code |
R-XUFM-X2
|
R-XUFM-X2
|
Non-rep Pk Forward Current-Max |
1500 A
|
1800 A
|
Number of Elements |
2
|
2
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
100 A
|
100 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
833 W
|
625 W
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Current-Max |
500 µA
|
500 µA
|
Reverse Recovery Time-Max |
0.095 µs
|
0.095 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
Terminal Position |
UPPER
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MF200K04F3-BP with alternatives
Compare MIMMF200ZB040DK1 with alternatives