MIMXRT1021DAF5A
vs
MIMXRT1021DAF5B
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
LQFP-100
|
LQFP-100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
|
Factory Lead Time |
15 Weeks
|
15 Weeks
|
Samacsys Manufacturer |
NXP
|
NXP
|
Has ADC |
YES
|
|
Address Bus Width |
13
|
13
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
24 MHz
|
24 MHz
|
DMA Channels |
YES
|
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e3
|
e3
|
Length |
14 mm
|
14 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of DMA Channels |
32
|
32
|
Number of I/O Lines |
57
|
|
Number of Serial I/Os |
14
|
14
|
Number of Terminals |
100
|
100
|
On Chip Data RAM Width |
8
|
8
|
Operating Temperature-Max |
95 °C
|
95 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (words) |
262144
|
262144
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Speed |
500 MHz
|
500 MHz
|
Supply Current-Max |
90 mA
|
90 mA
|
Supply Voltage-Max |
1.3 V
|
1.3 V
|
Supply Voltage-Min |
1.25 V
|
1.25 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|