ML2261CCQ
vs
ADC08061CIJ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICRO LINEAR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
5.1 V
|
6.1 V
|
| Analog Input Voltage-Min |
-0.1 V
|
-0.1 V
|
| Conversion Time-Max |
1.06 µs
|
0.56 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.965 mm
|
24.51 mm
|
| Linearity Error-Max (EL) |
0.39%
|
0.4%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP20,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Supply Current-Max |
14 mA
|
20 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.965 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Sample Rate |
|
1.5 MHz
|
|
|
|
Compare ML2261CCQ with alternatives
Compare ADC08061CIJ with alternatives