MM74HC154N
vs
5962-9558201QFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
LANSDALE SEMICONDUCTOR INC
|
| Package Description |
DIP, DIP24,.3
|
DFP, FL16,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 ENABLE INPUTS
|
USABLE AS 1 TO 8 DEMULTIPLEXER
|
| Family |
HC/UH
|
TTL/H/L
|
| JESD-30 Code |
R-PDIP-T24
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
31.915 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.004 A
|
0.016 A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP24,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Prop. Delay@Nom-Sup |
42 ns
|
30 ns
|
| Propagation Delay (tpd) |
42 ns
|
32 ns
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
5.334 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| Base Number Matches |
5
|
2
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| Input Conditioning |
|
STANDARD
|
| Power Supply Current-Max (ICC) |
|
35 mA
|
| Screening Level |
|
MIL-PRF-38535 Class Q
|
|
|
|
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