MMZ1608D500C vs BMB-1J-0330L-N8 feature comparison

MMZ1608D500C TDK Corporation

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BMB-1J-0330L-N8 TE Connectivity

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TDK CORP TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8504.50.80.00 8504.50.80.00
Samacsys Manufacturer TDK
Construction Chip Bead Multilayer Chip
DC Resistance-Max 0.25 Ω 0.25 Ω
Filter Type FERRITE CHIP FERRITE CHIP
Height 0.6 mm 0.8 mm
JESD-609 Code e3
Length 1.6 mm 1.6 mm
Mounting Type SURFACE MOUNT SURFACE MOUNT
Number of Functions 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Impedance 50 OHM Ω 330 OHM Ω
Packing Method TR, 7 INCH TR
Rated Current 0.5 A 0.5 A
Terminal Finish MATTE TIN
Width 0.8 mm 0.8 mm
Base Number Matches 4 1
Package Description EIA STD PACKAGE SIZE 0603, 2 PIN
Case Code 0603
Frequency-Max 100 MHz
Frequency-Min 100 MHz

Compare MMZ1608D500C with alternatives

Compare BMB-1J-0330L-N8 with alternatives