MN574AL
vs
HI1-574AJD-5
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO NETWORKS CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP28,.6
|
DIP-28
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
24 V
|
24 V
|
| Analog Input Voltage-Min |
-24 V
|
-24 V
|
| Conversion Time-Max |
25 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
35.56 mm
|
|
| Linearity Error-Max (EL) |
0.012%
|
0.024%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.05 MHz
|
0.05 MHz
|
| Seated Height-Max |
4.22 mm
|
|
| Supply Current-Max |
20 mA
|
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
4
|
| Technology |
|
BIPOLAR
|
|
|
|
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