MPC555LFMZP40
vs
MPC555LFAVR40
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
End Of Life
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272
|
27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
45 Weeks, 4 Days
|
|
| Date Of Intro |
1997-09-16
|
1997-09-16
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
IT ALSO OPERATES AT 5 V
|
ALSO REQUIRES 5V SUPPLY
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| CPU Family |
MPC500
|
MPC500
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING-POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| JESD-609 Code |
e0
|
e1
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
8
|
|
| Number of I/O Lines |
101
|
101
|
| Number of Serial I/Os |
4
|
4
|
| Number of Terminals |
272
|
272
|
| Number of Timers |
3
|
3
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
26624
|
26624
|
| ROM (words) |
458752
|
458752
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Current-Max |
250 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MPC555LFMZP40 with alternatives
Compare MPC555LFAVR40 with alternatives