MPC561MZP56 vs MPC556 feature comparison

MPC561MZP56 Freescale Semiconductor

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MPC556 Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388 BGA,
Pin Count 388
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B272
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines 16
Number of Terminals 388 272
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
RAM (bytes) 32768
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm
Speed 56 MHz 40 MHz
Supply Voltage-Max 2.7 V 3.6 V
Supply Voltage-Min 2.5 V 3 V
Supply Voltage-Nom 2.6 V 3.3 V
Surface Mount YES YES
Technology CMOS HCMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead/Silver (Sn62Pb36Ag2)
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1

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