MPC8248VRTIEA
vs
MPC8313CVRADDC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A002
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-609 Code |
e2
|
e2
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
245
|
260
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
Tin/Silver (Sn/Ag)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516
|
| Factory Lead Time |
|
52 Weeks
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
66.67 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B516
|
| Length |
|
27 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
516
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA516,26X26,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.55 mm
|
| Speed |
|
266 MHz
|
| Supply Voltage-Max |
|
1.05 V
|
| Supply Voltage-Min |
|
0.95 V
|
| Supply Voltage-Nom |
|
1 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
27 mm
|
|
|
|
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