MPC8260AZUMHBB vs MPC8255AZUMHBB feature comparison

MPC8260AZUMHBB Motorola Mobility LLC

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MPC8255AZUMHBB Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA480,29X29,50
Pin Count 480 480
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
Length 37.5 mm 37.5 mm
Low Power Mode NO NO
Number of Terminals 480 480
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 2.7 V 2.2 V
Supply Voltage-Min 2.4 V 1.9 V
Supply Voltage-Nom 2.5 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code BGA480,29X29,50
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MPC8255AZUMHBB with alternatives