MPC8270ZQMIBA vs MPC8270CZQMIBA feature comparison

MPC8270ZQMIBA Freescale Semiconductor

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MPC8270CZQMIBA NXP Semiconductors

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
Pin Count 516
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz 266 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e0
Length 27 mm 27 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz 66.67 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.45 V 1.45 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
Factory Lead Time 52 Weeks

Compare MPC8270ZQMIBA with alternatives

Compare MPC8270CZQMIBA with alternatives