MPC8270ZUQLD
vs
MPC8247CVRMIBA
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
LBGA, BGA480,29X29,50
|
BGA-516
|
Pin Count |
480
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
333 MHz
|
|
External Data Bus Width |
64
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B516
|
JESD-609 Code |
e0
|
e2
|
Length |
37.5 mm
|
27 mm
|
Low Power Mode |
NO
|
|
Moisture Sensitivity Level |
5
|
3
|
Number of Terminals |
480
|
516
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA480,29X29,50
|
BGA516,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
2.55 mm
|
Speed |
83.33 MHz
|
|
Supply Voltage-Max |
1.6 V
|
1.575 V
|
Supply Voltage-Min |
1.45 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Silver (Sn/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
37.5 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
SoC
|
Base Number Matches |
3
|
1
|
Factory Lead Time |
|
52 Weeks
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare MPC8270ZUQLD with alternatives
Compare MPC8247CVRMIBA with alternatives