MPC8347EZUAGF
vs
MPC8349ZUAGDB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
|
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
5A992
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
66 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B672
|
|
JESD-609 Code |
e0
|
|
Length |
35 mm
|
|
Low Power Mode |
YES
|
|
Number of Terminals |
672
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA672,34X34,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.69 mm
|
|
Speed |
400 MHz
|
|
Supply Voltage-Max |
1.26 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
35 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
672
|
|
|
|
Compare MPC8347EZUAGF with alternatives
Compare MPC8349ZUAGDB with alternatives