MPC8358EVRAGDDA vs MPC8358EVRAGDGA feature comparison

MPC8358EVRAGDDA NXP Semiconductors

Buy Now Datasheet

MPC8358EVRAGDGA NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668 29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668
Reach Compliance Code compliant compliant
ECCN Code 5A002.A.1 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks 52 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B668 S-PBGA-B668
JESD-609 Code e2 e2
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 668 668
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA668,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.46 mm 2.46 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MPC8358EVRAGDDA with alternatives

Compare MPC8358EVRAGDGA with alternatives