MPC850CVR50BU vs MCF5235CVM150 feature comparison

MPC850CVR50BU NXP Semiconductors

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MCF5235CVM150 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description BGA, BGA256,16X16,50 ROHS COMPLIANT, MAPBGA-256
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days 13 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 26 24
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 23 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 1.6 mm
Speed 50 MHz 150 MHz
Supply Voltage-Max 3.6 V 1.6 V
Supply Voltage-Min 3 V 1.4 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper - with Nickel barrier
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature LOW POWER MODE TAKEN FROM LOW POWER MODE
Clock Frequency-Max 75 MHz

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