MPC850DEVR50BU vs MC9328MX1VM20 feature comparison

MPC850DEVR50BU Freescale Semiconductor

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MC9328MX1VM20 Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 26 25
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 23 mm 14 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.6 mm
Speed 50 MHz 200 MHz
Supply Voltage-Max 3.465 V 2 V
Supply Voltage-Min 3.135 V 1.8 V
Supply Voltage-Nom 3.3 V 1.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER OVER NICKEL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 23 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

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