MPX5700GP vs MPX700GP feature comparison

MPX5700GP NXP Semiconductors

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MPX700GP Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description PLASTIC, UNBODY PACKAGE-6
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 57 Weeks, 3 Days
Samacsys Manufacturer NXP
Accuracy-Max (%) 2.5%
Additional Feature TEMPERATURE COMPENSATED, SIGNAL CONDITION
Body Breadth 8 mm 8 mm
Body Height 28.7 mm 28.7 mm
Body Length or Diameter 29.46 mm 29.46 mm
Housing PLASTIC
Linearity (%) 2.5 %
Mounting Feature THROUGH HOLE MOUNT THROUGH HOLE MOUNT
Offset-Nom 0.20V 20MV
Operating Current-Max 10 mA 6 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Range 0.20-4.70V 20-80mV
Output Type ANALOG VOLTAGE ANALOG VOLTAGE
Port Type THREADED BARBED
Pressure Range-Max 101.5 Psi 101.52 Psi
Pressure Range-Min
Pressure Sensing Mode GAUGE GAGE
Response Time 1000 µs 1000 µs
Sensors/Transducers Type PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE
Supply Voltage-Max 5.25 V 6 V
Supply Voltage-Min 4.75 V 3 V
Surface Mount NO NO
Termination Type SOLDER SOLDER
Base Number Matches 2 1
Package Shape/Style ROUND

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