MQ80960MC-25
vs
5962-9094603MYX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
CERAMIC, QFP-164
|
GQFF,
|
| Pin Count |
164
|
164
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
50 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-CQFP-F164
|
S-CQFP-F164
|
| JESD-609 Code |
e0
|
|
| Length |
28.702 mm
|
28.705 mm
|
| Low Power Mode |
NO
|
|
| Number of Terminals |
164
|
164
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
GQFF
|
GQFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, GUARD RING
|
FLATPACK, GUARD RING
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.92 mm
|
2.92 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28.702 mm
|
28.705 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare MQ80960MC-25 with alternatives
Compare 5962-9094603MYX with alternatives