MRF24WN0MB-I/RM
vs
47L04-I/P
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
ROHS COMPLIANT, MODULE-37
|
DIP-8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.32.00.51
|
JESD-30 Code |
R-XXMA-N37
|
R-PDIP-T8
|
Length |
26.67 mm
|
9.271 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
37
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
Seated Height-Max |
2.28 mm
|
5.334 mm
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
NO
|
Telecom IC Type |
TELECOM CIRCUIT
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
UNSPECIFIED
|
DUAL
|
Width |
17.78 mm
|
7.62 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
4 Weeks
|
Date Of Intro |
|
2016-10-10
|
Samacsys Manufacturer |
|
Microchip
|
Access Time-Max |
|
400 ns
|
JESD-609 Code |
|
e3
|
Memory Density |
|
4096 bit
|
Memory IC Type |
|
MEMORY CIRCUIT
|
Memory Width |
|
8
|
Mixed Memory Type |
|
EEPROM+SRAM
|
Number of Ports |
|
1
|
Number of Words |
|
512 words
|
Number of Words Code |
|
512
|
Operating Mode |
|
SYNCHRONOUS
|
Organization |
|
512X8
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP8,.3
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Technology |
|
CMOS
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare MRF24WN0MB-I/RM with alternatives
Compare 47L04-I/P with alternatives