MS1N5308
vs
1N5308
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SEMICONDUCTORS INC
|
| Package Description |
O-LALF-W2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
sINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JEDEC-95 Code |
DO-7
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
|
| Knee Impedance-Max |
35000 Ω
|
|
| Limiting Voltage-Max |
2.15 V
|
2.15 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Power Dissipation-Max |
0.475 W
|
0.6 W
|
| Qualification Status |
Not Qualified
|
|
| Regulation Current-Nom (Ireg) |
2.7 mA
|
2.7 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
FIELD EFFECT
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Base Number Matches |
1
|
24
|
| Dynamic Impedance-Min |
|
320000 Ω
|
|
|
|
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