MSM3764-20AS
vs
8201002EX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
|
| Package Description |
DIP, DIP16,.3
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.02
|
|
| Access Time-Max |
200 ns
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-XDIP-T16
|
|
| JESD-609 Code |
e0
|
|
| Memory Density |
65536 bit
|
|
| Memory IC Type |
PAGE MODE DRAM
|
|
| Memory Width |
1
|
|
| Number of Terminals |
16
|
|
| Number of Words |
65536 words
|
|
| Number of Words Code |
64000
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
64KX1
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Qualification Status |
Not Qualified
|
|
| Refresh Cycles |
128
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
MOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
1
|
|
|
|
|
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