MSM3764-20AS vs MT4264C-12 feature comparison

MSM3764-20AS LAPIS Semiconductor Co Ltd

Buy Now Datasheet

MT4264C-12 Micron Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD MICRON TECHNOLOGY INC
Package Description DIP, DIP16,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Time-Max 200 ns 120 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-XDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM
Memory Width 1 1
Number of Terminals 16 16
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 128 256
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 4
Supply Current-Max 0.03 mA

Compare MSM3764-20AS with alternatives

Compare MT4264C-12 with alternatives