MSP430F6633IZQWT vs MSP430F6633ZQWT feature comparison

MSP430F6633IZQWT Texas Instruments

Buy Now Datasheet

MSP430F6633ZQWT Texas Instruments

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA-113 BGA, BGA(UNSPEC)
Pin Count 113 100
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES
Additional Feature ALSO OPERATES 1.8V AT 8 MHZ
Address Bus Width
Bit Size 16 16
Boundary Scan YES
CPU Family MSP430 MSP430
Clock Frequency-Max 32 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PBGA-B113
JESD-609 Code e1
Length 7 mm
Moisture Sensitivity Level 3
Number of DMA Channels 6
Number of External Interrupts
Number of I/O Lines 74
Number of Serial I/Os 1
Number of Terminals 113
Number of Timers 18
On Chip Data RAM Width 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA BGA
Package Equivalence Code BGA113,12X12,20 BGA(UNSPEC)
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 16384 16384
RAM (words) 16
ROM (words) 131072 131072
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare MSP430F6633IZQWT with alternatives

Compare MSP430F6633ZQWT with alternatives