MT29F4G08ABADAWP-AITX:D
vs
W29N04GVSJAA
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
WINBOND ELECTRONICS CORP
|
Package Description |
TSSOP, TSSOP48,.8,20
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
18 Weeks
|
|
Samacsys Manufacturer |
Micron
|
Winbond
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
NO
|
Data Retention Time-Min |
10
|
10
|
Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
Length |
18.4 mm
|
18.4 mm
|
Memory Density |
4294967296 bit
|
4294967296 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
4K
|
4K
|
Number of Terminals |
48
|
48
|
Number of Words |
536870912 words
|
536870912 words
|
Number of Words Code |
512000000
|
512000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512MX8
|
512MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP1
|
TSOP1
|
Package Equivalence Code |
TSSOP48,.8,20
|
TSSOP48,.78,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Page Size |
1K words
|
1K words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3.3 V
|
3 V
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
YES
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Sector Size |
128K
|
128K
|
Standby Current-Max |
0.0001 A
|
0.0001 A
|
Supply Current-Max |
0.035 mA
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Toggle Bit |
NO
|
YES
|
Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
Width |
12 mm
|
12 mm
|
Write Cycle Time-Max (tWC) |
0.00002 ms
|
0.000025 ms
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MT29F4G08ABADAWP-AITX:D with alternatives
Compare W29N04GVSJAA with alternatives