MT29F4G08ABADAWP-IT:D
vs
K9WBG08U1M-IIB00
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
PLASTIC, TSOP1-48
|
VBGA, LGA52(UNSPEC)
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Micron
|
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| Data Retention Time-Min |
10
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G48
|
R-XBGA-B52
|
| JESD-609 Code |
e3
|
|
| Length |
18.4 mm
|
17 mm
|
| Memory Density |
4294967296 bit
|
34359738368 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
4K
|
16K
|
| Number of Terminals |
48
|
52
|
| Number of Words |
536870912 words
|
4294967296 words
|
| Number of Words Code |
512000000
|
4000000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512MX8
|
4GX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSOP1
|
VBGA
|
| Package Equivalence Code |
TSSOP48,.8,20
|
LGA52(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY
|
| Page Size |
1K words
|
4K words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Programming Voltage |
3.3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Sector Size |
128K
|
256K
|
| Standby Current-Max |
0.0001 A
|
0.0001 A
|
| Supply Current-Max |
0.035 mA
|
0.035 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Toggle Bit |
NO
|
NO
|
| Type |
SLC NAND TYPE
|
|
| Width |
12 mm
|
12 mm
|
| Write Cycle Time-Max (tWC) |
0.00002 ms
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
LGA
|
| Pin Count |
|
52
|
| Access Time-Max |
|
25 ns
|
|
|
|
Compare MT29F4G08ABADAWP-IT:D with alternatives
Compare K9WBG08U1M-IIB00 with alternatives