MT41K256M16HA-15E:E vs H5TC4G63MFR-H9I feature comparison

MT41K256M16HA-15E:E Micron Technology Inc

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H5TC4G63MFR-H9I SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SK HYNIX INC
Package Description 9 X 14 MM, LEAD FREE, FBGA-96 TFBGA, BGA96,9X16,32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 14 mm 13 mm
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR DRAM DDR3L DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 256MX16 256MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.45 V 1.45 V
Supply Voltage-Min (Vsup) 1.283 V 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 9.4 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Pin Count 96
Access Time-Max 0.255 ns
Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
Operating Temperature-Max 85 °C
Operating Temperature-Min -45 °C
Output Characteristics 3-STATE
Package Equivalence Code BGA96,9X16,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 4,8
Standby Current-Max 0.02 A
Supply Current-Max 0.24 mA
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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