MT41K256M16HA-187EM:E
vs
MT41K256M16LY-107:N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
TFBGA,
FBGA-96
Pin Count
96
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e1
Length
14 mm
13.5 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
DDR3L DRAM
DDR3L DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
256MX16
256MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.45 V
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
9 mm
7.5 mm
Base Number Matches
1
1
Rohs Code
Yes
Samacsys Manufacturer
Micron
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
OTHER
Compare MT41K256M16HA-187EM:E with alternatives
Compare MT41K256M16LY-107:N with alternatives