MT41K256M16TW-107 IT:P
vs
H5TC4G63MFR-PBI
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
SK HYNIX INC
|
| Part Package Code |
|
BGA
|
| Package Description |
|
TFBGA, BGA96,9X16,32
|
| Pin Count |
|
96
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.36
|
| Access Mode |
|
MULTI BANK PAGE BURST
|
| Access Time-Max |
|
0.225 ns
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
|
800 MHz
|
| I/O Type |
|
COMMON
|
| Interleaved Burst Length |
|
4,8
|
| JESD-30 Code |
|
R-PBGA-B96
|
| Length |
|
13 mm
|
| Memory Density |
|
4294967296 bit
|
| Memory IC Type |
|
DDR3L DRAM
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
96
|
| Number of Words |
|
268435456 words
|
| Number of Words Code |
|
256000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-45 °C
|
| Organization |
|
256MX16
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Equivalence Code |
|
BGA96,9X16,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Refresh Cycles |
|
8192
|
| Seated Height-Max |
|
1.2 mm
|
| Self Refresh |
|
YES
|
| Sequential Burst Length |
|
4,8
|
| Standby Current-Max |
|
0.02 A
|
| Supply Current-Max |
|
0.24 mA
|
| Supply Voltage-Max (Vsup) |
|
1.45 V
|
| Supply Voltage-Min (Vsup) |
|
1.283 V
|
| Supply Voltage-Nom (Vsup) |
|
1.35 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
9.4 mm
|
| Base Number Matches |
|
1
|
|
|
|
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