MT47H32M16CB-3 vs MT47H32M16GC-3:B feature comparison

MT47H32M16CB-3 Micron Technology Inc

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MT47H32M16GC-3:B Micron Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description FBGA, BGA60,9X11,32 12 X 12.50 MM, FBGA-84
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Time-Max 0.45 ns 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz 333 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 4,8 4,8
JESD-30 Code R-PBGA-B60 R-PBGA-B84
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR2 DRAM DDR2 DRAM
Memory Width 16 16
Number of Terminals 60 84
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Organization 32MX16 32MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA60,9X11,32 BGA84,9X15,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Sequential Burst Length 4,8 4,8
Standby Current-Max 0.005 A 0.007 A
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Part Package Code BGA
Pin Count 84
Access Mode FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
JESD-609 Code e0
Length 12.5 mm
Number of Functions 1
Number of Ports 1
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Current-Max 0.35 mA
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD SILVER
Width 12 mm

Compare MT47H32M16CB-3 with alternatives

Compare MT47H32M16GC-3:B with alternatives