MT48LC8M16A2B4-6A
vs
MT48LC8M16A2B4-6AAAT:L
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
,
|
VFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| JESD-609 Code |
e1
|
e1
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
54
|
| HTS Code |
|
8542.32.00.02
|
| Access Mode |
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
|
5.4 ns
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
|
S-PBGA-B54
|
| Length |
|
8 mm
|
| Memory Density |
|
134217728 bit
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
54
|
| Number of Words |
|
8388608 words
|
| Number of Words Code |
|
8000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
8MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1 mm
|
| Self Refresh |
|
YES
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
8 mm
|
|
|
|
Compare MT48LC8M16A2B4-6A with alternatives
Compare MT48LC8M16A2B4-6AAAT:L with alternatives