MT49H32M18CBM-18:A vs GS4576C18GL-24 feature comparison

MT49H32M18CBM-18:A Micron Technology Inc

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GS4576C18GL-24 GSI Technology

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer MICRON TECHNOLOGY INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LEAD FREE, UBGA-144 TFBGA,
Pin Count 144 144
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 15 ns
Additional Feature AUTO REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 533 MHz
I/O Type SEPARATE
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 70 °C
Operating Temperature-Min
Organization 32MX18 32MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TFBGA
Package Equivalence Code BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Sequential Burst Length 2,4,8
Standby Current-Max 0.055 A
Supply Current-Max 1.335 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Self Refresh YES
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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