MT49H32M18CBM-18:B vs GS4576C18GM-25 feature comparison

MT49H32M18CBM-18:B Micron Technology Inc

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GS4576C18GM-25 GSI Technology

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC GSI TECHNOLOGY
Part Package Code BGA
Package Description LEAD FREE, UBGA-144 LBGA,
Pin Count 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.32 8542.32.00
Samacsys Manufacturer Micron GSI TECHNOLOGY
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 15 ns
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 32MX18 32MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.25 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 1 1
Date Of Intro 2017-10-03
Operating Temperature-Max 95 °C
Operating Temperature-Min
Temperature Grade OTHER

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