MT58L256V18PB-4.4 vs AS7C33128NTD36A-200BC feature comparison

MT58L256V18PB-4.4 Micron Technology Inc

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AS7C33128NTD36A-200BC Alliance Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC ALLIANCE SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description 14 X 22 MM, BGA-119 LQFP,
Pin Count 119 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.9 ns 8.5 ns
Additional Feature AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
Clock Frequency-Max (fCLK) 227 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0
Length 22 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.575 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1

Compare MT58L256V18PB-4.4 with alternatives

Compare AS7C33128NTD36A-200BC with alternatives