Datasheets
MT58L256V18PB-4.4 by: Micron Technology Inc

Standard SRAM, 256KX18, 2.9ns, CMOS, PBGA119, 14 X 22 MM, BGA-119

Part Details for MT58L256V18PB-4.4 by Micron Technology Inc

Overview of MT58L256V18PB-4.4 by Micron Technology Inc

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Part Details for MT58L256V18PB-4.4

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MT58L256V18PB-4.4 Part Data Attributes:

MT58L256V18PB-4.4 Micron Technology Inc
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MT58L256V18PB-4.4 Micron Technology Inc Standard SRAM, 256KX18, 2.9ns, CMOS, PBGA119, 14 X 22 MM, BGA-119
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description 14 X 22 MM, BGA-119
Pin Count 119
Reach Compliance Code not_compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 2.9 ns
Additional Feature AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
Clock Frequency-Max (fCLK) 227 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 4718592 bit
Memory IC Type STANDARD SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 119
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.4 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.575 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for MT58L256V18PB-4.4

This table gives cross-reference parts and alternative options found for MT58L256V18PB-4.4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT58L256V18PB-4.4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K7I161884B-FC16 DDR SRAM, 1MX18, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 Samsung Semiconductor MT58L256V18PB-4.4 vs K7I161884B-FC16
AS7C33128NTD36A-200BC ZBT SRAM, 128KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Alliance Semiconductor Corporation MT58L256V18PB-4.4 vs AS7C33128NTD36A-200BC
CY7C1345B-50AC Cache SRAM, 128KX36, 11ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor MT58L256V18PB-4.4 vs CY7C1345B-50AC
CXK77N36R160GB-3 Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Sony Semiconductor MT58L256V18PB-4.4 vs CXK77N36R160GB-3
HM6AEB18202BPL50 2MX18 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165 Renesas Electronics Corporation MT58L256V18PB-4.4 vs HM6AEB18202BPL50
71V3576YS150BGGI Cache SRAM, 128KX36, 3.8ns, CMOS, PBGA119, ROHS COMPLIANT, BGA-119 Integrated Device Technology Inc MT58L256V18PB-4.4 vs 71V3576YS150BGGI
IS61QDPB21M18A-300B4 QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc MT58L256V18PB-4.4 vs IS61QDPB21M18A-300B4
K7Q163682A-FC13 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 Samsung Semiconductor MT58L256V18PB-4.4 vs K7Q163682A-FC13
CY7C1386FV25-250BGI Cache SRAM, 512KX36, 2.6ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 Cypress Semiconductor MT58L256V18PB-4.4 vs CY7C1386FV25-250BGI
CY7C1383AV25-100AC Standard SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor MT58L256V18PB-4.4 vs CY7C1383AV25-100AC

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