MT9HTF12872RHIY-667XX vs M485L2829MT0-CA0 feature comparison

MT9HTF12872RHIY-667XX Micron Technology Inc

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M485L2829MT0-CA0 Samsung Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code SODIMM MODULE
Package Description LEAD FREE, MO-274, SORDIMM-200 DIMM, DIMM200,24
Pin Count 200 200
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N200 R-XDMA-N200
JESD-609 Code e4
Length 67.6 mm
Memory Density 9663676416 bit 9663676416 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128MX72 128MX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.8 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 2.7 V
Supply Voltage-Min (Vsup) 1.7 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish GOLD
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Width 30 mm
Base Number Matches 1 1
Access Time-Max 0.8 ns
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code DIMM200,24
Refresh Cycles 8192
Supply Current-Max 4.5 mA
Terminal Pitch 0.6 mm

Compare MT9HTF12872RHIY-667XX with alternatives

Compare M485L2829MT0-CA0 with alternatives