MT9HTF12872RHIY-667XX vs WV3HG264M72EEU534D4-SG feature comparison

MT9HTF12872RHIY-667XX Micron Technology Inc

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WV3HG264M72EEU534D4-SG Microsemi Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC MICROSEMI CORP-PMG MICROELECTRONICS
Part Package Code SODIMM MODULE
Package Description LEAD FREE, MO-274, SORDIMM-200 DIMM,
Pin Count 200 200
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST DUAL BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N200 R-XDMA-N200
JESD-609 Code e4 e4
Length 67.6 mm
Memory Density 9663676416 bit 9663676416 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128MX72 128MX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.8 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount NO NO
Technology CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish GOLD GOLD
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Width 30 mm
Base Number Matches 1 1
Access Time-Max 0.5 ns
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare WV3HG264M72EEU534D4-SG with alternatives