MTFC128GAPALNS-AAT
vs
MTFC128GAPALNA-AAT
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Package Description |
TFBGA-153
|
TBGA-100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2018-11-26
|
2018-11-26
|
Samacsys Manufacturer |
Micron
|
Micron
|
JESD-30 Code |
R-PBGA-B153
|
R-PBGA-B100
|
JESD-609 Code |
e1
|
e1
|
Length |
13 mm
|
18 mm
|
Memory Density |
1099511627776 bit
|
1099511627776 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
153
|
100
|
Number of Words |
137438953472 words
|
137438953472 words
|
Number of Words Code |
128000000000
|
128000000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128GX8
|
128GX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programming Voltage |
2.7 V
|
2.7 V
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
11.5 mm
|
14 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MTFC128GAPALNS-AAT with alternatives
Compare MTFC128GAPALNA-AAT with alternatives