MX29L8100TXBI-12 vs GT28F800B3T120 feature comparison

MX29L8100TXBI-12 Macronix International Co Ltd

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GT28F800B3T120 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD INTEL CORP
Part Package Code BGA BGA
Package Description BGA, CSP, MICRO, BGA-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Rohs Code No
Factory Lead Time 4 Weeks
Additional Feature USER SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK
Boot Block TOP
Command User Interface YES
Data Polling NO
Length 7.91 mm
Number of Sectors/Size 8,15
Output Characteristics 3-STATE
Package Equivalence Code BGA45,6X8,30
Seated Height-Max 1 mm
Sector Size 4K,32K
Standby Current-Max 0.00001 A
Supply Current-Max 0.023 mA
Terminal Pitch 0.75 mm
Toggle Bit NO
Type NOR TYPE
Width 6.5 mm

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