MX29LV640UXBC-90 vs NAND01GW4A2DZA6F feature comparison

MX29LV640UXBC-90 Macronix International Co Ltd

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NAND01GW4A2DZA6F STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD STMICROELECTRONICS
Part Package Code BGA BGA
Package Description LFBGA, BGA63,8X12,32 BGA,
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 12000 ns
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0 e1
Length 12 mm
Memory Density 67108864 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 128
Number of Terminals 63 63
Number of Words 4194304 words 67108864 words
Number of Words Code 4000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.3 mm
Sector Size 32K
Standby Current-Max 0.000015 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES
Type NOR TYPE
Width 11 mm
Base Number Matches 1 2

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