MX7524UE/883B
vs
5962-87701032A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DEFENSE LOGISTICS AGENCY
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCN,
|
CERAMIC, LCC-20
|
| Pin Count |
20
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
S-XQCC-N20
|
|
| JESD-609 Code |
e4
|
e0
|
| Length |
8.89 mm
|
8.89 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QCCN
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Settling Time-Max |
0.5 µs
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD OVER NICKEL
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.89 mm
|
8.89 mm
|
| Base Number Matches |
1
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Settling Time-Nom (tstl) |
|
0.18 µs
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MX7524UE/883B with alternatives
Compare 5962-87701032A with alternatives