MX7574TD
vs
MX7574JN
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
DIP
|
DIP
|
Pin Count |
18
|
18
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
|
Analog Input Voltage-Max |
10 V
|
10 V
|
Analog Input Voltage-Min |
-10 V
|
-10 V
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-XDIP-T18
|
R-PDIP-T18
|
JESD-609 Code |
e0
|
e0
|
Linearity Error-Max (EL) |
0.2%
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
18
|
18
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Bit Code |
BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
|
BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP18,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.72 mm
|
4.572 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
2
|
Package Description |
|
DIP,
|
Length |
|
22.86 mm
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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