N82S123ANB vs DM74S188AN feature comparison

N82S123ANB NXP Semiconductors

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DM74S188AN Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 32X8 32X8
Output Characteristics 3-STATE OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.096 mA 0.11 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 16
Length 21.755 mm
Seated Height-Max 5.08 mm
Width 7.62 mm

Compare N82S123ANB with alternatives

Compare DM74S188AN with alternatives