NAND01GW4A0BZA6T vs AM29DL640H60WHI feature comparison

NAND01GW4A0BZA6T Numonyx Memory Solutions

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AM29DL640H60WHI Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX SPANSION INC
Part Package Code BGA BGA
Package Description BGA, 12 X 11 MM, 0.80 MM PITCH, FBGA-63
Pin Count 63 63
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 12000 ns 60 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Memory Density 1073741824 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 67108864 words 4194304 words
Number of Words Code 64000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 2
Rohs Code No
Alternate Memory Width 8
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Length 12 mm
Moisture Sensitivity Level 3
Number of Sectors/Size 16,126
Package Equivalence Code BGA63,8X12,32
Peak Reflow Temperature (Cel) 260
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.8 mm
Toggle Bit YES
Type NOR TYPE
Width 11 mm

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