NAND01GW4A0CZA1
vs
NAND01GW4A1AZA6F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
NUMONYX
Part Package Code
BGA
BGA
Package Description
BGA,
TFBGA,
Pin Count
63
63
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
12000 ns
12000 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Type
NAND TYPE
Base Number Matches
2
2
JESD-609 Code
e1
Length
15 mm
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
Terminal Finish
TIN SILVER COPPER
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8.5 mm
Compare NAND01GW4A0CZA1 with alternatives
Compare NAND01GW4A1AZA6F with alternatives