NAND01GW4B2CZA1F
vs
S29JL064H55BFI003
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
SPANSION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA,
|
12 X 11 MM, LEAD FREE, FPBGA-63
|
| Pin Count |
63
|
63
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
25000 ns
|
55 ns
|
| JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
| JESD-609 Code |
e1
|
e1
|
| Length |
11 mm
|
12 mm
|
| Memory Density |
1073741824 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
63
|
63
|
| Number of Words |
67108864 words
|
4194304 words
|
| Number of Words Code |
64000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
64MX16
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.05 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Type |
SLC NAND TYPE
|
NOR TYPE
|
| Width |
9 mm
|
11 mm
|
| Write Cycle Time-Max (tWC) |
25 ms
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Alternate Memory Width |
|
8
|
| Boot Block |
|
BOTTOM/TOP
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
16,126
|
| Package Equivalence Code |
|
BGA63,8X12,32
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
8K,64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.045 mA
|
| Toggle Bit |
|
YES
|
|
|
|
Compare NAND01GW4B2CZA1F with alternatives
Compare S29JL064H55BFI003 with alternatives