NC7SP17L6X vs 74AUP1G3208GW feature comparison

NC7SP17L6X Fairchild Semiconductor Corporation

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74AUP1G3208GW Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NEXPERIA
Part Package Code MICROPAK MLP
Package Description 1 MM, ROHS COMPLIANT, MO-252UAAD, MICROPAK-6 TSSOP,
Pin Count 6
Manufacturer Package Code 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family P AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G6
JESD-609 Code e4 e3
Length 1.45 mm 2 mm
Load Capacitance (CL) 30 pF
Logic IC Type BUFFER OR-AND GATE
Max I(ol) 0.0005 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 3
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 46.3 ns
Propagation Delay (tpd) 46.3 ns 20.1 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Seated Height-Max 0.55 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.9 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 3 2

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Compare 74AUP1G3208GW with alternatives