NCP177BMX330TCG
vs
NCP606MN33T2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
XDFN-4
|
3 X 3.30 MM, 0.95 MM PITCH, LEAD FREE, DFN-6
|
| Manufacturer Package Code |
711AJ
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
17 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Dropout Voltage1-Max |
0.175 V
|
0.22 V
|
| Input Voltage-Max |
5.5 V
|
6 V
|
| Input Voltage-Min |
3.8 V
|
3.52 V
|
| JESD-30 Code |
S-PDSO-N4
|
R-XDSO-N6
|
| Length |
1 mm
|
3.3 mm
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
6
|
| Operating Temperature TJ-Max |
85 °C
|
150 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.5 A
|
0.5 A
|
| Output Voltage1-Max |
3.3495 V
|
3.366 V
|
| Output Voltage1-Min |
3.2175 V
|
3.234 V
|
| Output Voltage1-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.43 mm
|
0.9 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
NICKEL GOLD PALLADIUM
|
TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Voltage Tolerance-Max |
2.5%
|
|
| Width |
1 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
6
|
| JESD-609 Code |
|
e3
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
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